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void-free die soldering Diotec utilizes a vacuum die soldering process, which enables silicon chips to be soldered to metal with exceptional consistency and void free quality.
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see the diotec difference Diotec's diode stacks are ideally suited for preventing overvoltage and overcurrent damage to electronic systems..

 

 

 

 

 

 

High Quality Diotec Difference - Void Free Die Soldering

Diode failure symptoms include: shorted diodes, thermal runaway, overheated diodes, charred diodes, no mechanical integrity, or with no obvious symptoms.
The most likely cause of diode failure is poor die attach soldering, which creates solder voids. The result is poor heat dissipation, creating hot spots, die solder reflow and ultimately diode failure.

Poor die attach soldering is a serious problem in diode manufacturing that is more common than one might think. In the photographs below, diodes produced by a prestigious multinational semiconductor manufacturer were examined for die solder quality. These diodes were provided by one of our potential customers who have experienced serious quality problems and premature failures.

Common Solder Void Problems

Solder Void Die Failure
Sample X: Diode Pried Open
Solder Void Diode Failure
Section A
Solder Void Diode Failure
Section B

Large solder voids (crater-like areas) are revealed in the solder layer of these samples. The black areas are the silicon die.

A number solder voids can be clearly seen in these diode samples. These voids:
1) Greatly weaken the mechanical integrity of the diode;
2) Increase the forward voltage drop; and
3) Severely restrict the dissipation of heat from the die.

Restricted heat dissipation causes the diode to operate at elevated temperatures, which could lower its current handling and/or cause premature failure.

Diode Separation at the Solder-Die Interface

Solder Void Diode Failure
Sample Y: Diode Pried Open
Solder Void Diode Failure
Section C: Only Solder
Solder Void Diode Failure
Section D: Die Side

These diode samples show complete diode separation at the solder-die interface. The chip is intact in Section D; however, the solder covers only ~50% of the die.

The solder has either failed to wet and bond to the die's surface (surface outlined in Red on Section C) or is riddled with voids. As a result, this diode has no mechanical strength and may fail on impact if dropped or struck. Additionally, the thermal resistance of this diode is so high that thermal runaway is a certainty.

See the High Quality Diotec Difference - Void Free Die Soldering

Fast Recovery Diode High Voltage Diode
Diotec Sample:
Diode Pried Open
Fast Recovery Diode High Voltage Diode
Section E
Fast Recovery Diode High Voltage Diode
Section F

Cross-sections of Diotec samples show no void areas. When pried open, Diotec diodes break at the silicon die.

Diotec's superior soldering results in exceptional mechanical strength and heat dissipation, and lower forward voltage drop.

Diotec utilizes an advanced, computer-controlled, vacuum die soldering process, which enables silicon chips to be soldered to metal with exceptional consistency and void free quality.

Diotec diodes and bridge rectifiers have unmatched heat dissipation, cooler junction temperatures, lower leakage currents, and reduced thermal stress. The high quality die attachment ensures that Diotec diodes survive mechanical shock without bond failure, another common problem with most offshore "cheap" diodes.

Should you want:
- To discuss this topic further?
- A free analysis similar to that shown here to determine the quality of the diodes you are now using. We'll tell it like we see it and return your items with supporting pictures.
- To try our products in your application?
- Request product samples

your request.

Download a copy of this diode failure analysis

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